– S-T12A heating station with cell phone motherboard heating groove phone double layers board pre-heating rework station, motherboard desoldering station, heating station for Phone motherboard desoldering repair. 1pcs heating station main unit only.
– Adopting a 185-degree layered process to remove the mobile phone motherboard, not only from our fine analysis of solder paste but depends on the special heating design and precise temperature control of SS-T12A
– SS-T12A only heats the area that the board needs to be removed to prevent improper heating
– Dual bayonet design, make sure the motherboard is stable on the stage
– High purity copper is used as a film to ensure uniform heat transfer and heat
– 100V-240V SS-T12A phone mainboard stratified 185 degrees accurate rapid separated disassembly heating station
– Support seven kinds of chip heating: T12A-X3; T12A-N11; T12A-XF; T12A-CPU; T12A-F; T12A-Android; T12A-FACE